Samtec has expanded its line of high speed edge card solutions to include a new high density socket featuring a bi-level mating design. Two levels of contacts are staggered on 1mm (.0394”) centerline which creates a card effective 0,5mm (.0197”) pitch. The BEC5 Series High Density Edge Card Socket is ideal for high speed applications benefiting from its rugged Edge Rate™ contacts. Samtec's Edge Rate Contacts are designed for superior impedance control and reduced broadside coupling with increased durability and cycle life.
Other features of the BEC5 Series include:
.5mm (.0197”) pitch
Rugged Edge Rate™ contacts for improved signal integrity performance
Accepts standard 1,60mm (.062”) and 2,40mm (.093”) thick cards
Available with 60, 80, 100, 120, 140, 160, 180 and 200 positions
Welds tabs, alignment pins and lead-free solder charge terminations for easy board processing
Selective gold plating
Pick-n-place pad and tape-n-reel packaging as standard
Tin-lead solder charges, alternative plating and pin counts also available
Two levels of contacts,
staggered on 1mm centerline,
create a card effective .5mm pitch.