Carteret, NJ –February 26, 2016– The introduction of Sarcon® YR-c by Fujipoly® gives electronic packaging engineers an unprecedented level of performance from a thin film, thermal interface product. The new formulation delivers a thermal conductivity of 4.0 W/m°K with a thermal resistance of only .08°Cin2/W.
When placed between a heat source such as a high-performance semiconductor and a nearby heatsink, the Sarcon® YR-c effectively eliminates near-microscopic air gaps that exist between the components. By increasing surface area contact it is possible to measurably improve the cooling performance of the heatsink.
This V-0 rated thin film is recommended for applications with operational temperatures that range from -40°C to +150°C. Sarcon® YR-c is available in thicknesses of 0.2, 0.3, and 0.45mm. It can be ordered in roll form up to 150mm wide or can be die-cut to your exact specification requirements.
Fujipoly® America Corporation is a wholly owned subsidiary of Fuji Polymer Industries Co., Ltd. of Japan. An ISO9001:2008 registered company, Fujipoly® America Corporation specializes in the fabrication of silicone rubber technology. It is a leader in the areas of elastomeric connectors, thermal interface materials, fusible tapes, LCD bezel assemblies, and custom silicone rubber extrusions. Fuji Polymer Industries Co., Ltd., has eight divisions worldwide, located in North America, Europe and Asia and an international network of distributors and representatives. The company's North American operations are based in Carteret, New Jersey.
For more information, call (732) 969-0100 or visit us on the Web at http://www.fujipoly.com.