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Utech Electronics - Press Release

Samtec Announcement – HD Edge Card - BEC5

Samtec Image


March 23rd, 2011

Samtec has expanded its line of high speed edge card solutions to include a new high density socket featuring a bi-level mating design. Two levels of contacts are staggered on 1mm (.0394”) centerline which creates a card effective 0,5mm (.0197”) pitch. The BEC5 Series High Density Edge Card Socket is ideal for high speed applications benefiting from its rugged Edge Rate™ contacts. Samtec's Edge Rate Contacts are designed for superior impedance control and reduced broadside coupling with increased durability and cycle life.

Other features of the BEC5 Series include:

  • .5mm (.0197”) pitch
  • Rugged Edge Rate™ contacts for improved signal integrity performance
  • Accepts standard 1,60mm (.062”) and 2,40mm (.093”) thick cards
  • Available with 60, 80, 100, 120, 140, 160, 180 and 200 positions
  • Welds tabs, alignment pins and lead-free solder charge terminations for easy board processing
  • Selective gold plating
  • Pick-n-place pad and tape-n-reel packaging as standard
  • Tin-lead solder charges, alternative plating and pin counts also available
  • Two levels of contacts, staggered on 1mm centerline, create a card effective .5mm pitch.

More information is available: BEC5


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